Achieving Excellent Vertical Hole Fill on Thermally Challenging Boards Using Selective Soldering

While the introduction of the selective soldering process has provided the industry with a valuable tool for overcoming many challenges associated with PTH processing, equipment alone will not ensure the ability to solder a high thermal mass PCB. These difficult applications have proven that advancements in our techniques and process knowledge are just as critical as the advancements in equipment. With process development through experimental design in combination with the flux application, preheating combinations, and soldering techniques available on today’s Selective Soldering machines, excellent vertical hole fill on high thermal mass PCBs can be achieved.