Murray Percival articles and white papers

PCB Assembly

Reflow Soldering

A selection of articles on Reflow Soldering; from selecting the right solder product for the components you’ll be using to the testing and fine tuning of your reflow process for optimal yield.

Placement Equipment

A section of articles that feature component placement systems, commonly called pick-and-place machines. These are robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB).

Stencil Printing

Stencil Printing is the first and most critical stage of the electronics manufacturing process. Our selection of articles looks at the different stencil technologies and printing materials and the various factors that determine the outcome of a successful printing process.

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