An improved imaging system for inspecting BGA Devices

Inspection
Murray Percival articles and white papers

Improved imaging system for inspecting BGA Devices

The ability to see and react to hidden production deficiencies can mean the difference between life and death of a solder joint.

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Anatomy of a good solder joint

Physical effects of solder joints during reflow

Typical solder joint failures

Different inspection methods and their limitations

Closing the quality control loop in a subjective process

 

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