Alpha Tape and Reel Solder Preforms
Alpha Preforms can be added to solder paste deposits for surface mount or through hole pars to increase the overall solder paste volume of the solder joint. Additional solder volume may be needed for SMT parts due to the fact the stencil printing process may be limited to the volume it can provide. For through hole parts where you are utilizing the Pin In Paste process it may be necessary to add solder volume to accomplish adequate hole fill. These preforms come in tape and reel packaging and are placed with you pick and place process.