Challenges in BGA and CSP Rework

Murray Percival articles and white papers
Desoldering

Challenges in BGA and CSP Rework

Leadless parts do create a challenge when reworking such parts but with the right techniques, tools and materials most anyone can be successful…..let us show you how.

• Removal techniques and options

• Site preparation techniques and material

• Placement options

• Heating technologies and profiling

• Post repair inspection

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