Evaluation of Under Stencil Cleaning Paper

Murray Percival articles and white papers
Under Stencil Cleaning Paper

Evaluation of under stencil cleaning paper

Solder paste stencil printing is known to be one of the most difficult processes to assure quality in the circuit board assembly process. One of the key materials in this process is the under stencil cleaning paper. This article describes how cleaning paper can be tested and how big a difference there can be between materials.

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