Print and Profile Fine Feature Parts
To characterize the solder paste printing process, both the individual aspects of the process and the interactions between the aspects must be understood. The main aspects of the printing process are paste, stencil, printer and board. Each can be singularly optimized to obtain desired results, but the system as a whole should be optimized to yield the most robust process. The reflow profiling process can often be overshadowed by the importance of proper printing. It is in the reflow process where the interconnections are permanently formed, and great care should be taken to ensure that these connections are formed under the proper thermal conditions. Profiling methods, profile types, and resulting reflow recipes are also discussed.
Stencil design, reflow soldering, circuit board assembly process, stencil printing