Solder Paste Inspection Best Practices

Murray Percival articles and white papers

Solder Paste Inspection Best Practices

On board printer inspection is used to verify an accurate deposit of solder paste onto the Printed Circuit Board (PCB) pads to insure mechanical and electrical connection with the components. Systems should have the capability to inspect for pad coverage and bridging of a just-printed circuit board, as well as the bridging potential using stencil inspection. Utilizing your printers on board solder paste inspection can help you build and maintain a robust printing process and maintain high yields.

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