The Basics of Reflow Soldering
The basics of reflow soldering, a thermal process designed to melt solder paste which has been placed on the exposed conductive pads of a circuit board and the contacts or leads of an electronic device to form a solder joint. The article discusses the four phases of the reflow profile; ramp, soak, spike and cooling. It also gives an overview of reflow solder ovens. An article by Paul Austen, a thirty year veteran Senior Project Engineer with ECD in Milwaukie, OR.