Soldering Defects Under Area Array Packages: Head-In-Pillow and Non-Wet Open

Desoldering, Rework, Soldering
Murray Percival articles and white papers
Soldering defects

The War on Soldering Defects under Area Array Packages: Head-In-Pillow and Non-Wet Open

The most difficult aspect of any soldering defect on an area array package is the inability to observe the defect easily. It is important to understand the characteristics of soldering defects in order to identify the proper action to take to mitigate the defects in a soldering process.

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