Vapor Phase Reflow Soldering Helps Eliminate
Manufacturability Challenges

Smaller products translate to denser printed circuit board (PCB) layouts, smaller, more complex components and inaccessible
interconnections. This adds technical complexity to manufacturing process, particularly in the area of reflow soldering. Contract manufacturers must find ways to address technical complexity while finding ways to reduce cost. This article looks at how Protech Global Solutions, LP (www.protechglobalsolutions.com), an electronics manufacturing services (EMS) provider with manufacturing facilities in El Paso, Texas and Juarez, Mexico uses vapor reflow phase soldering technology to deal with many of these challenges.