An Improved Imaging System for Inspecting BGA, CSP, Flip Chip, and Other Hidden Solder Connections
Inspecting BGA, CSP, Flip Chip, and Other Hidden Solder Connections…Read More
Apollo Seiko provided chart of the life cycle of their RS-iron tips.
Learn some of the basic techniques used to remove and replace BGA devices.
This article will explain there is a difference between selective soldering equipment that can effect quality and or throughput.
Since the move from lead to lead-free solders, a common complaint has been short tip life…