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Optimizing Stencil Design for Lead-Free SMT Processing

February 20, 2018
MurrayP

In addition to aperture design guidelines, methods of optimizing the overall stencil design will be reviewed.

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Under Stencil Cleaning Paper

Evaluation of Under Stencil Cleaning Paper

November 23, 2016
MurrayP

All under stencil cleaning paper is not manufactured the same way nor clean solder paste from the stencil with equal effectiveness…

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3D Solder Paste Inspection, a Yield Improvement Strategy that Works

February 12, 2015
Murray Percival III

Learn to understand what your yields are, how they are affected by the printing process, how to measure them…

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Print and Profile Fine Feature Parts

November 6, 2014
MurrayP

This article will discuss the several aspects of printing fine featured surface mount devices including stencils, solder paste…

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Murray Percival Company Headquarters
2014 Brown Rd
Auburn Hills, MI 48326

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