In this white paper package design, reflow profiles, and solder paste chemistry are discussed in the form of application studies.
Smaller products translate to denser printed circuit board (PCB) layouts, smaller, more complex components and inaccessible interconnections.
Vapor phase reflow is a mature process that solves the issue of preserving small discrete components on large thermal mass assemblies. It has shown in this testing, and previously reported work to afford superior wetting to convection oven reflow.
This paper presents the results of an initial study to determine if the use of only 3 thermocouples can be utilized to verify a PCB’s profile during the reflow operation…