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An improved imaging system for inspecting BGA Devices

September 14, 2015
MurrayP

This article will discuss the anatomy of a BGA solder joint, defects, the need to inspect and some imaging system inspection methods.

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3D X-ray system

Twelve things you should know before buying a 3D X-ray system

February 12, 2015
Murray Percival III
Best X-Ray system, Circuit board X-Ray system, how to buy an X-Ray system, Selecting an X-Ray system

This article will give you some good ideas about buying a 3D CT X-ray system that will help eliminate some of the confusion…

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Head in pillow defect of BGA package case study

Solder Paste Inspection Best Practices

February 12, 2015
Murray Percival III

This article will discuss the solder paste inspection features that some stencil printers offer and how they are best set up and used.

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Head in pillow defect of BGA package case study

What you need to know about AOI X-Ray and ICT

February 12, 2015
Murray Percival III

Learn how simple inspection tools and software can help you qualify and improve your circuit board assembly process.

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3D Solder Paste Inspection, a Yield Improvement Strategy that Works

February 12, 2015
Murray Percival III

Learn to understand what your yields are, how they are affected by the printing process, how to measure them…

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Maximizing Production Efficiency through Automated Inspection

February 12, 2015
Murray Percival III

Learn the difference between AOI and SPI, the technologies available and how they are best utilized to increase…

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Visual Inspection

Key Elements for Good Visual Inspection

February 12, 2015
Murray Percival III

Learn about different types of magnification equipment that is used for inspecting circuit boards and components for defects.

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Murray Percival Company Headquarters
2014 Brown Rd
Auburn Hills, MI 48326

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